Samsung and SK Hynix are upgrading their NAND chip factories in China to produce chips with over 200 layers, aiming to compete with YMTC and meet AI demand despite US export restrictions.
01Summary
- 01Samsung plans to convert its Xi'an plant to make 286-layer V9 NAND chips, targeting 5,000 wafers per month by December 2025 and 40,000 by December 2027.
- 02SK Hynix seeks to switch its Dalian facility to produce NAND products with 240 layers or more, currently making 192-layer chips.
- 03YMTC held 38.5% of China's NAND market in Q2 2025, up from 28% in 2024, overtaking Samsung's 33.5% share.
- 04Both companies must annually seek US licences to install American-made equipment in China, and Washington has indicated it intends not to grant licences for technology upgrades or capacity expansion.
02Why it matters
These upgrades affect global memory chip supply and prices, as NAND is essential for smartphones, PCs and AI data centres, and the outcome may influence US-China tech competition.
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